Title of Your Abstract

I. M. Author, U. R. Too1), and Y. R. Younot2)

Department, Institution/Company, Town, State/Country,
1) Department, Institution/Company, Town, State/Country
2) Department, Institution/Company, Town, State/Country
Email address of corresponding author

Summary: Clearly state what is new in this first paragraph. The degree of novelty and clearness will be some of the major evaluation criteria in the review process. Relate your work to what has been already done. This section should describe your major achievements and represent a summary and conclusions of your contribution in a nutshell. Please do not submit papers that have already been published elsewhere. A maximum of 200 words should be appropriate for this section.

Keywords: Provide a maximum of five keywords here.

Motivation

Here is some space to describe the background of your work. Cite references using brackets [1]. You may refer to the figures if appropriate to illustrate basic structures, device designs etc. (Fig. 1) not forgetting to describe what the reader should read out of this figure.

|[pic] |
|Fig. 1: One-column figure example. Briefly characterize here the main idea of the figure. |

Results

It is mandatory to present sample results in your abstract. Illustrate your approach and latest results by referring to figures as demonstrated here (Fig. 2 and Fig. 3). Clearly distinguish between already obtained results and those you might expect during the course of your work and eventually include in the final paper.

Please submit your two-page abstract according to this template, as MS-Word document, Version 97 or later, and as PDF document, attached to an e-mail to siitme@siitme.ro.

Please use file name according to the followings:

___Abstract_ SIITME2013.doc

Example for abstract file name: D_P_Farcas_Abstract_SIITME2013.doc

Topics:
A. Emerging Technologies & Trends in Advanced Packaging;
B. Power Electronics and Microsystems Packaging;
C. Assembly and Manufacturing Technology;
D. Design of Electronic Circuits and Systems;
E. Electronics Simulation & Modelling;
F. Electronics Applications;
G. Optoelectronics & Advanced Communication Packaging;
H. Applied Reliability;
I. Challenge in Global Education.

Presentation type: P. Poster; O. Oral; K. Keynote; S. Special, e.g. paper will not be submitted.

Whether you use this MS-Word template or not, please adhere to the style as closely as possible. In particular, please use the following formats: paper format: DIN A4 = 297 x 210 mm; page type area: upper and bottom margin: 25 mm, outer margin: 20 mm, inner margin: 25 mm; paragraph format: line space: single, spacing before paragraphs: 6 pt, spacing before titles: 12 pt, no intent, text alignment: justified, title alignment: centred or left, figure capture: centred; letter type: Times New Roman, letter size: 12 pt, letter size in titles: 22, 18 or 14 pt; letter size in figure capture and references: 11 pt.

Underline the presenting author and make sure that the email address of the corresponding author is provided.

|[pic] |[pic] |
|Fig. 2: Example of two figures simply placed in an invisible |Fig. 3: You can use automatic fitting by first preparing this table |
|two-column table. |and then by drag- |
| |and-dropping your graphic e.g. from the |
| |clip board into the respective table field. |

If you want to include photographs or other bitmaps please check that the resolution is appropriate for the final size (e.g. 200 to 300 dpi in the final size) and all labelling is readable.

Acknowledgement

If necessary, put here short acknowledgement.

References

1] I. Knoweverything, "Title of important work", J. Appl. Phys., vol. 38, no. 1, pp. 33-44, 2006.