Free Essay

Case

In: Business and Management

Submitted By naseemaj
Words 9368
Pages 38
UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45

SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

BiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLER
FEATURES

DESCRIPTION

D Enhanced Replacement for UC3842A Family
D
D
D
D
D
D
D
D
D
D

UCC38C4x family is a high-performance currentmode PWM controller. It is an enhanced BiCMOS version with pin-for-pin compatibility to the industry standard UC384xA family and UC384x family of PWM controllers. In addition, lower startup voltage versions of 7 V are offered as
UCC38C40 and UCC38C41.

With Pin-to-Pin Compatibility
1-MHz Operation
50-μA Standby Current, 100-μA Maximum
Low Operating Current of 2.3 mA at 52 kHz
Fast 35-ns Cycle-by-Cycle Overcurrent
Limiting
±1-A Peak Output Current
Rail-to-Rail Output Swings with 25-ns Rise and 20-ns Fall Times
±1% Initial Trimmed 2.5-V Error Amplifier
Reference
Trimmed Oscillator Discharge Current
New Under Voltage Lockout Versions
MSOP-8 Package Minimizes Board Space

Providing necessary features to control fixed frequency, peak current-mode power supplies, this family offers the following performance advantages. The device offers high-frequency operation up to 1 MHz with low start-up and operating currents, thus minimizing start-up loss and low operating power consumption for improved efficiency. The device also features a very fast current-sense-to-output delay time of
35 ns and a ±1 A peak output current capability with improved rise and fall times for driving large external MOSFETs directly.

APPLICATIONS

D Switch-Mode Power Supplies
D dc-to-dc Converters
D Board Mount Power Modules

The UCC38C4x family is offered in 8-pin packages, MSOP (DGK), SOIC (D) and PDIP (P).

FUNCTIONAL BLOCK DIAGRAM
5.0 V

8

VREF

7

GND

6

+

VDD

5

UVLO

OUT

+

VREF

VREF
GOOD LOGIC

RT/CT

4

OSC
(NOTE)
2.5 V

FB

+

ERROR AMP

T

2R

S

2
R

COMP

1

CS

1V

Q

R

Q

3
Note: Toggle flip--flop used only in UCC38C41, UCC38C44, and UCC38C45.

UDG--99139

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright © 2003 -- 2010, Texas Instruments Incorporated

www.ti.com

1

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

recommended operating conditions
MIN

MAX

UNIT

Input voltage, VDD

18

Output voltage range, VOUT

18

V

200

mA

--20

mA

105

°C

Average output current, IOUTW
Reference output current, IOUT(ref)W
Operating junction temperature, TJW


--40

V

It is not recommended that the device operate under conditions beyond those specified in this table for extended periods of time.

absolute maximum ratings over operating free-air temperature (unless otherwise noted)}w



Supply voltage (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 V
(MAX ICC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
Output current, IOUT peak . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1 A
Output energy, capacitive load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 μJ
Voltage rating (COMP, CS, FB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --0.3 V to 6.3 V
(OUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --0.3 V to 20 V
(RT/CT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --0.3 V to 6.3 V
(VREF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Error amplifier output sink current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA
Total Power Dissipation at TA = 25°C: D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 °C/W
DGK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C/W
Operating junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --55°C to 150°C
Storage temperature range Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --65°C to 150°C
Lead Temperature (Soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
§ All voltages are with respect to ground. Currents are positive into and negative out of the specified terminals. Consult the Packaging Section of the Databook for thermal limitations and considerations of the package.
AVAILABLE OPTIONS

100%

UCC28C42D

UCC28C42P

UCC28C42DGK

8.4V / 7.6V

UCC28C43D

UCC28C43P

UCC28C43DGK

UCC28C40D

UCC28C40P

UCC28C40DGK

UCC28C44D

UCC28C44P

UCC28C44DGK

8.4V / 7.6V

UCC28C45D

UCC28C45P

UCC28C45DGK

UCC28C41D

UCC28C41P

UCC28C41DGK

14.5V / 9.0V

50%

MSOP-8
SMALL OUTLINE
(DGK){

7.0V / 6.6V

--40°C to 105°C
40°C

PDIP-8
PLASTIC DIP
(P)

14.5V / 9.0V

100%

SOIC-8
SMALL OUTLINE
(D){

7.0V / 6.6V

MAXIMUM
DUTY CYCLE

UVLO
ON/OFF
14.5V / 9.0V

TA = TJ

UCC38C42D

UCC38C42P

UCC38C42DGK

8.4V / 7.6V

UCC38C43D

UCC38C43P

UCC38C43DGK

7.0V / 6.6V



2

UCC38C40P

UCC38C40DGK

UCC38C44D

UCC38C44P

UCC38C44DGK

8.4V / 7.6V

UCC38C45D

UCC38C45P

UCC38C45DGK

7.0V / 6.6V

50%

UCC38C40D

14.5V / 9.0V

0 C 70 C
0°C to 70°C

UCC38C41D

UCC38C41P

UCC38C41DGK

D (SOIC--8) and DGK (MSOP--8) packages are available taped and reeled. Add R suffix to device type (e.g.
UCC28C42DR) to order quantities of 2500 devices per reel. Tube quantities are 75 for D packages (SOIC--8) and
80 for DGK package (MSOP--8), and 50 for P package (PDIP-8).

www.ti.com

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

electrical characteristics VDD = 15 V (See Note 1), RT = 10 kΩ, CT = 3.3 nF, CVDD = 0.1μF and no load on the outputs, TA = -40°C to 105°C for the UCC28C4x and TA = 0°C to 70°C for the UCC38C4x,
TA = TJ (unless otherwise noted)
PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Reference Section
Output voltage, initial accuracy

TA = 25°C

IOUT = 1mA

4.9

Line regulation

VDD = 12 V to 18 V

Load regulation

1mA to 20mA

Temperature stability

See Note 2

Total output variation

See Note 2

Output noise voltage

10 Hz to 10 kHz,

TA = 25°C,

See Note 2

Long term stability

1000 hours,

TA = 125°C,

5.0

See Note 2

5.1

V

0.2

20

mV

3

25

mV

0.4

mV/°C

0.2
4.82

Output short circuit

5.18
50

V μV 5

25

mV

–45

–30

–55

mA kHz Oscillator Section
Initial accuracy

TA = 25°C,

Voltage stability

VDD = 12 V to 18 V

See Note 3

Temperature stability

TMIN to TMAX,

Amplitude

50.5

53

55

0.2%

1.0%

RT/CT Pin peak-to-peak

1%

2.5%

See Note 2

1.9

RT/CT = 2 V,

RT/CT = 2 V,

See Note 4

Feedback input voltage, initial accuracy

VCOMP = 2.5 V,

TA = 25°C

Feedback input voltage, total variation

VCOMP = 2.5 V,

Input bias current

VFB = 5.0 V

Open-loop voltage gain (AVOL)

VOUT = 2 V to 4 V

65

90

dB

Unity gain bandwidth

See Note 2

1.0

1.5

MHz

Power supply rejection ratio (PSRR)

VDD = 12 V to 18 V

60

Output sink current

VFB = 2.7 V,

VCOMP = 1.1 V

Output source current

VFB = 2.3 V,

VCOMP = 5V

High-level output voltage (VOH)

VFB = 2.7 V,

RLOAD = 15 k to GND

Low-level output voltage (VOL)

VFB = 2.7 V,

RLOAD = 15 k to VREF

Discharge current

See Note 4

V

TA = 25°C,

7.7

8.4

9.0

mA

7.2

8.4

9.5

mA

2.475

2.500

2.525

2.45

2.50

2.55

V

–0.1

–2.0

μA

Error Amplifier Section
V

dB

2

14

mA

–0.5

–1.0

mA

5

6.8

V

0.1

1.1

V

2.85

3.00

3.15

V/V

0.9

1.0

1.1

V

–0.1

–2.0

μA

35

70

ns

Current Sense Section
Gain

See Note 5, 6

Maximum input signal

VFB < 2.4 V

Power supply rejection ratio (PSRR)

VDD = 12 V to 18 V, See Note 2, 5

Input bias current
CS to output delay
COMP to CS offset
NOTE:
NOTE:
NOTE:
NOTE:
NOTE:

VCS = 0 V

70

1.15

dB

V

1.
2.
3.
4.
5.

Adjust VDD above the start threshold before setting at 15 V.
Ensured by design. Not production tested.
Output frequencies of the UCC38C41, UCC38C44 and the UCC38C45 are half the oscillator frequency.
Oscillator discharge current is measured with RT = 10 kΩ to VREF.
Parameter measured at trip point of latch with VFB = 0 V.
ΔV
COM , 0V ≼ V
≼ 900mV
NOTE: 6. Gain is defined as ACS =
CS
ΔV
CS

www.ti.com

3

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

electrical characteristics VDD = 15 V (See Note 1), RT = 10 kΩ, CT = 3.3 nF, CVDD = 0.1μF and no load on the outputs, TA = -40°C to 105°C for the UCC28C4x and TA = 0°C to 70°C for the UCC38C4x,
TA = TJ (unless otherwise noted)
PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Output Section
VOUT low (RDS(on) pull-down)

ISINK = 200 mA

5.5

15

VOUThigh (RDS(on) pull-up)

ISOURCE = 200 mA

10

25

Rise tIme

TA = 25°C,

CLOAD = 1 nF

25

50

Fall time

TA = 25°C,

CLOAD = 1 nF

20

40

Ω ns Undervoltage Lockout Section
UCC38C42, UCC38C44

15.5

7.8

8.4

9.0

UCC38C40, UCC38C41

6.5

7.0

7.5

UCC38C42, UCC38C44

8

9

10

UCC38C43, UCC38C45

7.0

7.6

8.2

UCC38C40, UCC38C41

6.1

6.6

7.1

UCC38C42, UCC38C43, UCC38C40, VFB < 2.4 V

94%

96%

UCC38C44, UCC38C45, UCC38C41, VFB < 2.4 V

Minimum operating voltage

14.5

UCC38C43, UCC38C45

Start threshold

13.5

47%

48%

V

PWM Section
Maximum duty cycle
Minimum duty cycle

VFB > 2.6 V

0%

Current Supply Section
Start-up current (ISTART-UP)

VDD = Undervoltage lockout start threshold (--0.5 V)

50

100

μA

Operating supply current (IDD)

VFB = VCS = 0 V

2.3

3.0

mA

NOTE 1:

Adjust VDD above the start threshold before setting at 15 V.
PDIP (P) or SOIC (D) PACKAGE
(TOP VIEW)

COMP
FB
CS
RT/CT

4

1

8

2

7

3
4

6
5

MSOP (DGK) PACKAGE
(TOP VIEW)

COMP
FB
CS
RT/CT

VREF
VDD
OUT
GND

www.ti.com

1

8

2

7

3

6

4

5

VREF
VDD
OUT
GND

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

pin assignments
COMP: This pin provides the output of the error amplifier for compensation. In addition, the COMP pin is frequently used as a control port by utilizing a secondary-side error amplifier to send an error signal across the secondary-primary isolation boundary through an opto-isolator.
CS: The current sense pin is the non-inverting input to the PWM comparator. This is compared to a signal proportional to the error amplifier output voltage. A voltage ramp can be applied to this pin to run the device with a voltage mode control configuration.
FB: This pin is the inverting input to the error amplifier. The non-inverting input to the error amplifier is internally trimmed to 2.5 V ±1%.
GND: Ground return pin for the output driver stage and the logic level controller section.
OUT: The output of the on-chip drive stage. OUT is intended to directly drive a MOSFET. The OUT pin in the
UCC38C40, UCC38C42 and UCC38C43 is the same frequency as the oscillator, and can operate near 100% duty cycle. In the UCC38C41, UCC38C44 and the UCC38C45, the frequency of OUT is one-half that of the oscillator due to an internal T flipflop. This limits the maximum duty cycle to < 50%.
RT/CT: Timing resistor and timing capacitor. The timing capacitor should be connected to the device ground using minimal trace length.
VDD: Power supply pin for the device. This pin should be bypassed with a 0.1-μF capacitor with minimal trace lengths. Additional capacitance may be needed to provide hold up power to the device during startup.
VREF: 5-V reference. For stability, the reference should be bypassed with a 0.1-μF capacitor to ground using the minimal trace length possible.

www.ti.com

5

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

APPLICATION INFORMATION
This device is a pin-for-pin replacement of the bipolar UC3842 family of controllers, the industry standard PWM controller for single-ended converters. Familiarity with this controller family is assumed.
The UCC28C4x/UCC38C4x series is an enhanced replacement with pin-to-pin compatibility to the bipolar
UC284x/UC384x and UC284xA/UC384xA families. The new series offers improved performance when compared to older bipolar devices and other competitive BiCMOS devices with similar functionality. Note that these improvements discussed below generally consist of tighter specification limits that are a subset of the older product ratings, maintaining drop-in capability. In new designs these improvements can be utilized to reduce the component count or enhance circuit performance when compared to the previously available devices. advantages
This device increases the total circuit efficiency whether operating off-line or in dc input circuits. In off-line applications the low start-up current of this device reduces steady state power dissipation in the startup resistor, and the low operating current maximizes efficiency while running. The low running current also provides an efficiency boost in battery operated supplies. low voltage operation
Two members of the UCC38C4x family are intended for applications that require a lower start-up voltage than the original family members. The UCC38C40 and UCC38C41 have a turn-on voltage of 7.0 V typical and exhibit hysteresis of 0.4 V for a turn-off voltage of 6.6 V. This reduced start-up voltage enables use in systems with lower voltages, such as 12-V battery systems which are nearly discharged. high speed operation
The BiCMOS design allows operation at high frequencies that were not feasible in the predecessor bipolar devices. First, the output stage has been redesigned to drive the external power switch in approximately half the time of the earlier devices. Second, the internal oscillator is more robust with less variation as frequency increases. In addition, the current sense to output delay has been reduced by a factor of three, to 45ns typical.
These features combine to provide a device capable of reliable high frequency operation.
The UCC38C4x family oscillator is true to the curves of the original bipolar devices at lower frequencies yet extends the frequency programmability range to at least 1MHz. This allows the device to offer pin to pin capability where required yet capable of extending the operational range to the higher frequencies typical of latest applications. When the original UC3842 was released in 1984 most switching supplies operated between
20kHz and 100kHz. Today, the UCC38C4x can be used in designs cover a span roughly ten times higher than those numbers. start/run current improvements
The start--up current is only 60 μA typical, a significant reduction from the bipolar device’s ratings of 300uA
(UC384xA). For operation over the temperature range of --40 to 85°C the UCC28C4x devices offer a maximum startup current of 100 μA, an improvement over competitive BiCMOS devices. This allows the power supply designer to further optimize the selection of the startup resistor value to provide a more efficient design. In applications where low component cost overrides maximum efficiency the low run current of 2.3 mA, typical, may allow the control device to run directly through the single resistor to (+) rail, rather than needing a bootstrap winding on the power transformer, along with a rectifier. The start/run resistor for this case must also pass enough current to allow driving the primary switching MOSFET, which may be a few milliamps in small devices.

6

www.ti.com

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

APPLICATION INFORMATION
± 1% initial reference voltage
The BiCMOS internal reference of 2.5 V has an enhanced design and utilizes production trim to allow initial accuracy of ±1% at room temperature and ± 2% over the full temperature range. This can be used to eliminate an external reference in applications that do not require the extreme accuracy afforded by the additional device.
This is very useful for nonisolated dc-to-dc applications where the control device is referenced to the same common as the output. It is also applicable in offline designs that regulate on the primary side of the isolation boundary by looking at a primary bias winding, or perhaps from a winding on the output inductor of a buck-derived circuit. reduced discharge current variation
The original UC3842 oscillator did not have trimmed discharged current, and the parameter was not specified on the datasheet. Since many customers attempted to use the discharge current to set a crude deadtime limit the UC3842A family was released with a trimmed discharge current specified at 25°C. The
UCC28C4x/UCC38C4x series now offers even tighter control of this parameter, with approximately ±3% accuracy at 25°C, and less than 10% variation over temperature using the UCC28C4x devices. This level of accuracy can enable a meaningful limit to be programmed, a feature not currently seen in competitive BiCMOS devices. The improved oscillator and reference also contribute to decreased variation in the peak to peak variation in the oscillator waveform, which is often used as the basis for slope compensation for the complete power system. soft-start The following diagram provides a typical soft-start circuit for use with the UCC38C42. The values of R and C should be selected to bring the COMP pin up at a controlled rate, limiting the peak current supplied by the power stage. After the soft-start interval is complete the capacitor continues to charge to VREF, effectively removing the PNP transistor from circuit considerations.
The optional diode in parallel with the resistor forces a soft-start each time the PWM goes through UVLO and the reference (VREF) goes low. Without the diode,the capacitor otherwise remains charged during a brief loss of supply or brown-out, and no soft-start is enabled upon reapplication of VIN.

VREF
UCC38C42

8

COMP

1

GND
5

Figure 1

www.ti.com

UDG--01072

7

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

APPLICATION INFORMATION oscillator synchronization
The UCC38C4x oscillator has the same synchronization characteristics as the original bipolar devices. Thus, the information in the Application Note U--100A, UC3842/3/4/5 Provides Low-Cost Current-Mode Control, (TI
Literature No. SLUA143) still applies. The application note describes how a small resistor from the timing capacitor-to-ground can offer an insertion point for synchronization to an external clock, (see Figures 2 and 3).
Figure 2 shows how the UCC38C42 can be synchronized to an external clock source. This allows precise control of frequency and dead time with a digital pulse train.
8

VREF

4

RT / CT

RT

SYNCHRONIZATION
CIRCUIT INPUT
CT

24 Ω

UCC38C42
PWM

UDG--01069

Figure 2. Oscillator Synchronization Circuit

CLOCK
INPUT

PWM
OUT

UPPER THRESHOLD
LOW

HIGH

LOW
LOWER THRESHOLD

ON .

OFF .

ON .

VCT (ANALOG)

OUTPUT A

UPPER THRESHOLD
VCT
LOWER THRESHOLD

VSYNC (DIGITAL)

COMBINED

Figure 3. Synchronization to an External Clock

8

www.ti.com

UDG--01070

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

APPLICATION INFORMATION precautions The absolute maximum supply voltage is 20 V, including any transients that may be present. If this voltage is exceeded, device damage is likely. This is in contrast to the predecessor bipolar devices, which could survive up to 30 V. Thus, the supply pin should be decoupled as close to the ground pin as possible. Also, since no clamp is included in the device, the supply pin should be protected from external sources which could exceed the 20 V level. Careful layout of the printed board has always been a necessity for high frequency power supplies. As the device switching speeds and operating frequencies increase the layout of the converter becomes increasingly important. This 8-pin device has only a single ground for the logic and power connections. This forces the gate drive current pulses to flow through the same ground that the control circuit uses for reference. Thus, the interconnect inductance should be minimized as much as possible. One implication is to place the device (gate driver) circuitry close to the MOSFET it is driving. Note that this can conflict with the need for the error amplifier and the feedback path to be away from the noise generating components. circuit applications
Figure 4 shows a typical off-line application.
D50

F1

12 V
OUT

T1
AC INPUT
100 Vac -- 240 Vac
EMI FILTER
REQUIRED

+

R10

C12

BR1

D2

R11
C1A

C52

C3
D51

C18

C55

R56

L50

5V
OUT

R12

RT1

C53

D6

C54
R55

C5

SEC
COMMON
R6
IC2

R50

UCC38C44
1

COMP

REF 8

2

FB

R16

VCC 7

3

CS
RT/CT

IC2
C50

C13

OUT 6

4

Q1

GND 5

R50

R53

R52
C51

K
IC3
A

R

R54
UDG--01071

Figure 4. Typical Off-Line Application
Figure 5 shows the forward converter with synchronous rectification. This application provides 48 V to 3.3 V at
10 A with over 85% efficiency and uses the UCC38C42 as the secondary-side controller and UCC3961 as the primary-side startup control device.

www.ti.com

9

10

www.ti.com

46.4k

0.1uF

C5
7

6

5

4

3

2

AGnd

Ref

Rt

FB

SS

SD

OVS

R12
200

ucc3961

U1

R2

2

1

C7

8

9

10

11

12

13

14

T2

100pF

Vs

CS

PGnd

Out

Vdd

St

UVS

2.4k

R3

1.2k

4

3

R4
1.5k

300

R13

C8
1uF

Q2

470pF

C6

76.8k

R5

R6
4.7

C25
0.047uF

C10
2.7nF

0.1uF

C9

R8

R10
1k

5.1k

D1

R14

50k

R15

20k 40%

0.33

R9

Q1

C22
4.7nF

20k

R24

20k

402

R23

Q3

R25
20k

680pF

100

R28

R19
20

4.7

R26

C17
4700pF

3300pF

C12

5.6nF

C16

21.5k
C23

R17

R16

BAR74

D3

BAR74

D5

R20
10

1500pF

C11

4

3

2

1

4

3

2

1

Vcc

DT

Rt/Ct

CS

FB

U2

LODR

BTLO

HIDR

7.5k

R18

UCC38C4x

PGND

5

6

7

8

C19
470uF

4700pF

U4
TPS2832
IN
BOOT

COMP

R27
4.7

10

R21

Q4

GND

OUT

Vcc

REF

5

6

7

8

2uF

C26

470uF

C20

0.22uF

C13

+

R11

0.22uF

10nF

1

+

C4

C3

470uF

C1

R1
32.4k

10k

D2

T1

C18
+

VinN

VinP

R7

1nF

C2

L1
4.7uH

C14
1uF

C24
0.1uF

D6

BZX84C15LT1

PWRGND

0.1uF

C21

3r3V

100

R22

C15
1uF

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45

SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

APPLICATION INFORMATION
+

Figure 5. Forward Converter with Synchronous Rectification Using the UCC38C42 as the Secondary-Side Controller

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

TYPICAL CHARACTERISTICS
OSCILLATOR FREQUENCY vs TIMING RESISTANCE AND CAPACITANCE

OSCILLATOR DISCHARGE CURRENT vs TEMPERATURE
9.5

10 M

CT = 470 pF

1M

f - Frequency - Hz
-

IDISCH - Oscillator Discharge Current - mA
-

CT = 220 pF

CT = 1 nF
100 k

10 k
CT = 4.7 nF
CT = 2.2 nF
1k

1k

10 k

9.0

8.5

8.0

7.5

7.0

100 k

-50

-25

0

50

75

100

125

TJ - Temperature - °C
-

RT - Timing Resistance - Ω

Figure 6

Figure 7
COMP to CS OFFSET VOLTAGE (with CS = 0) vs TEMPERATURE

ERROR AMPLIFIER
FREQUENCY RESPONSE
200

1.8

90

180

1.6

160

1.4

GAIN

70

140

60

120

50

100

40

80

30

60

PHASE
MARGIN

1.0
0.8
0.6

40

10
1

10

100

1k

10 k

100 k

1M

0.4

20

20

0

1.2
COMP to CS

80

Phase Margin - (°)
-

100

Gain - (dB)
-

25

0.2

0
10 M

f - Frequency - Hz
-

0.0

-50

-25

0

25

50

75

100

125

TJ - Temperature - °C
-

Figure 8

Figure 9

www.ti.com

11

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

TYPICAL CHARACTERISTICS
REFERENCE VOLTAGE vs TEMPERATURE

ERROR AMPLIFIER REFERENCE VOLTAGE vs TEMPERATURE
2.55
VEAREF - Error Amplifier Reference Voltage - V
-

5.05

VREF - Reference Voltage - V
-

5.04
5.03
5.02
5.01
5.00
4.99
4.98
4.97
4.96
4.95
-50

-25

0

25

50

75

100

2.54
2.53
2.52
2.51
2.50
2.49
2.48
2.47
2.46
2.45

125

-50

-25

TJ - Temperature - °C
-

0

REFERENCE SHORT-CIRCUIT CURRENT vs TEMPERATURE

100

125

200

-37

IBIAS - Error Amplifier Input Bias Current - nA
-

ISC - Reference Short Circuit Current - mA
-

75

ERROR AMPLIFIER INPUT BIAS CURRENT vs TEMPERATURE

-35

-39
-41
-43
-45
-47
-49
-51
-53
-25

0
25
50
75
TJ - Temperature - °C
-

100

125

150
100
50
0
-50
-100
-150
-200

-50

-25

0

25
50
75
TJ - Temperature - °C
-

Figure 13

Figure 12

12

50

Figure 11

Figure 10

-55
-50

25

TJ - Temperature - °C
-

www.ti.com

100

125

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

TYPICAL CHARACTERISTICS

16

UNDERVOLTAGE LOCKOUT vs TEMPERATURE (UCC38C43 & UCC38C45)

UNDERVOLTAGE LOCKOUT vs TEMPERATURE (UCC38C42 & UCC38C44)
9.0

15

13

VUVLO - UVLO Voltage - V
-

14
UVLO
ON

12
UVLO
OFF

11
10
9

8.6
8.4
8.2
8.0
7.8
7.6

8

7.4

7

7.2

6

-50

-25

0

25

50

75

100

125

UVLO
OFF

7.0
-50

-25

0

TJ - Temperature - °C
-

Figure 14

25
50
75
TJ - Temperature - °C
-

100

125

Figure 15

UNDERVOLTAGE LOCKOUT vs TEMPERATURE (UCC38C40 & UCC38C41)
7.3
7.2

UVLO
ON

7.1
VUVLO - UVLO Voltage - V
-

VUVLO - UVLO Voltage - V
-

UVLO
ON

8.8

7.0
6.9
6.8
6.7
6.6
6.5
UVLO
OFF

6.4
6.3
-50

-25

0

25

50

75

100

125

TJ - Temperature - °C
Figure 16

www.ti.com

13

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

TYPICAL CHARACTERISTICS
SUPPLY CURRENT vs TEMPERATURE

SUPPLY CURRENT vs OSCILLATOR FREQUENCY

3.0

25

1-nF LOAD

20

2.8
IDD - Supply Current - mA
-

IDD - Supply Current - mA
-

2.9

15

10
NO LOAD

2.7
2.6
2.5
2.4

NO LOAD

2.3
2.2

5

2.1
0

2.0
200 k

0k

400 k
600 k f - Frequency - Hz
-

800 k

1M

-50

-25

0

Figure 17

40

OUTPUT RISE TIME AND FALL TIME vs TEMPERATURE

75

100

125

MAXIMUM DUTY CYCLE vs OSCILLATOR FREQUENCY
100

10% to 90%
VDD = 12 V

CT = 220 pF

tr
(1 nF)

90

30 tf (1 nF)

25

20

10

80

70

CT = 1 nF

60

15

-50

-25

0

25

50

75

100

125

TJ - Temperature - °C

50

0

500

1000

1500

f - Frequency - kHz
-

Figure 19

14

50

Figure 18

Duty Cycle - %
-

Output Rise and Fall TIme - ns
-

35

25

TJ - Temperature - °C
-

Figure 20

www.ti.com

2000

2500

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

TYPICAL CHARACTERISTICS
MAXIMUM DUTY CYCLE vs TEMPERATURE

100

MAXIMUM DUTY CYCLE vs TEMPERATURE
50

Output Rise and Fall TIme - ns
-

UCC38C40
UCC38C42
UCC38C43
Maximum Duty Cycle - %
-

98

96

94

92

UCC38C41
UCC38C44
UCC38C45

49

48

47

46

90
-50

-25

0

25

50

75

100

45

125

-50

-25

TJ - Temperature - °C
-

50

75

100

125

Figure 22

CURRENT SENSE THRESHOLD VOLTAGE vs TEMPERATURE

CS TO OUT DELAY TIME vs TEMPERATURE

70
65

1.05

tD - CD to OUT Delay Time - ns
-

VCS_th - Current Sense Threshold - V
-

25

TJ - Temperature - °C

Figure 21

1.10

0

1.00

0.95

60
55
50
45
40
35

0.90

-50

-25

0

25

50

75

100

125

TJ - Temperature - °C

30

-50

-25

0

25

50

75

100

125

TJ - Temperature - °C
-

Figure 23

Figure 24

www.ti.com

15

UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, UCC28C45
UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, UCC38C45
SLUS458E -- AUGUST 2001 -- REVISED OCTOBER 2010

Revision History
Revision SLUS458D to SLUS458E, 10/2010
1) Updated Operating Juction Temperature in the Recommended Operating Conditions Table, from

--55 to 150 to --40 to 105.

2) Updated Available Options Table heading from TA to TA = TJ.

16

www.ti.com

PACKAGE OPTION ADDENDUM

www.ti.com

20-Dec-2015

PACKAGING INFORMATION
Orderable Device

Status
(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (°C)

Device Marking
(4/5)

UCC28C40D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C40

UCC28C40DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C40

UCC28C40DGK

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C40

UCC28C40DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 85

28C40

UCC28C40DGKRG4

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 85

28C40

UCC28C40DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C40

UCC28C40DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C40

UCC28C40P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

-40 to 105

UCC28C40P

UCC28C41D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C41

UCC28C41DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C41

UCC28C41DGK

ACTIVE

VSSOP

DGK

8

100

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C41

UCC28C41DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C41

UCC28C41DGKRG4

ACTIVE

VSSOP

DGK

8

TBD

Call TI

Call TI

-40 to 105

UCC28C41DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C41

UCC28C41DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C41

UCC28C42D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C42

UCC28C42DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C42

Addendum-Page 1

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

20-Dec-2015

Orderable Device

Status
(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (°C)

Device Marking
(4/5)

UCC28C42DGK

ACTIVE

VSSOP

DGK

8

100

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C42

UCC28C42DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C42

UCC28C42DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C42

UCC28C42DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C42

UCC28C42P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

-40 to 105

UCC28C42P

UCC28C43D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C43

UCC28C43DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C43

UCC28C43DGK

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C43

UCC28C43DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C43

UCC28C43DGKRG4

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C43

UCC28C43DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C43

UCC28C43DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C43

UCC28C43P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

-40 to 105

UCC28C43P

UCC28C43PG4

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

-40 to 105

UCC28C43P

UCC28C44D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C44

UCC28C44DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C44

UCC28C44DGK

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C44

UCC28C44DGKG4

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 85

28C44

Addendum-Page 2

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

20-Dec-2015

Orderable Device

Status
(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (°C)

Device Marking
(4/5)

UCC28C44DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C44

UCC28C44DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C44

UCC28C44DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C44

UCC28C44P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

-40 to 105

UCC28C44P

UCC28C44PG4

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

-40 to 105

UCC28C44P

UCC28C45D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C45

UCC28C45DG4

ACTIVE

SOIC

D

8

TBD

Call TI

Call TI

-40 to 105

UCC28C45DGK

ACTIVE

VSSOP

DGK

8

100

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C45

UCC28C45DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C45

UCC28C45DGKRG4

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

-40 to 105

28C45

UCC28C45DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C45

UCC28C45DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 105

28C45

UCC28C45P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

-40 to 105

UCC28C45P

UCC38C40D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C40

UCC38C40DGK

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C40

UCC38C40DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C40

UCC38C40DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C40

UCC38C40DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C40

Addendum-Page 3

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

20-Dec-2015

Orderable Device

Status
(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (°C)

Device Marking
(4/5)

UCC38C40P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C40P

UCC38C41D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C41

UCC38C41DGK

ACTIVE

VSSOP

DGK

8

100

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C41

UCC38C41DGKG4

ACTIVE

VSSOP

DGK

8

100

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C41

UCC38C41DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C41

UCC38C41DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C41

UCC38C41P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C41P

UCC38C42D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C42

UCC38C42DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C42

UCC38C42DGK

ACTIVE

VSSOP

DGK

8

100

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C42

UCC38C42DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C42

UCC38C42DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C42

UCC38C42DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C42

UCC38C42P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C42P

UCC38C42PG4

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C42P

UCC38C43D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C43

UCC38C43DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C43

UCC38C43DGK

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C43

Addendum-Page 4

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

20-Dec-2015

Orderable Device

Status
(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (°C)

Device Marking
(4/5)

UCC38C43DGKG4

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C43

UCC38C43DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C43

UCC38C43DGKRG4

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C43

UCC38C43DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C43

UCC38C43DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C43

UCC38C43P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C43P

UCC38C43PG4

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C43P

UCC38C44D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C44

UCC38C44DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C44

UCC38C44DGK

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C44

UCC38C44DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C44

UCC38C44DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C44

UCC38C44DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C44

UCC38C44P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C44P

UCC38C44PG4

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C44P

UCC38C45D

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C45

UCC38C45DG4

ACTIVE

SOIC

D

8

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C45

UCC38C45DGK

ACTIVE

VSSOP

DGK

8

80

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C45

Addendum-Page 5

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

20-Dec-2015

Orderable Device

Status
(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (°C)

Device Marking
(4/5)

UCC38C45DGKR

ACTIVE

VSSOP

DGK

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAUAG

Level-2-260C-1 YEAR

0 to 70

38C45

UCC38C45DR

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C45

UCC38C45DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

38C45

UCC38C45P

ACTIVE

PDIP

P

8

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UCC38C45P

(1)

The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 6

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

20-Dec-2015

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UCC28C41, UCC28C43, UCC28C45 :

• Automotive: UCC28C41-Q1
• Enhanced Product: UCC28C43-EP, UCC28C45-EP
NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications

Addendum-Page 7

PACKAGE MATERIALS INFORMATION www.ti.com 22-Dec-2015

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

UCC28C40DGKR

Package Package Pins
Type Drawing
VSSOP

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC28C40DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC28C41DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC28C41DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC28C42DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC28C42DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC28C43DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC28C43DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC28C44DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC28C44DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC28C45DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC28C45DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC38C40DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC38C40DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC38C41DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC38C42DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC38C42DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC38C43DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 22-Dec-2015

Device

Package Package Pins
Type Drawing

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

UCC38C43DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC38C44DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC38C44DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

UCC38C45DGKR

VSSOP

DGK

8

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Q1

UCC38C45DR

SOIC

D

8

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

*All dimensions are nominal

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

UCC28C40DGKR

VSSOP

DGK

8

2500

366.0

364.0

50.0

UCC28C40DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC28C41DGKR

VSSOP

DGK

8

2500

367.0

367.0

35.0

UCC28C41DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC28C42DGKR

VSSOP

DGK

8

2500

367.0

367.0

35.0

UCC28C42DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC28C43DGKR

VSSOP

DGK

8

2500

367.0

367.0

35.0

UCC28C43DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC28C44DGKR

VSSOP

DGK

8

2500

366.0

364.0

50.0

UCC28C44DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC28C45DGKR

VSSOP

DGK

8

2500

366.0

364.0

50.0

UCC28C45DR

SOIC

D

8

2500

340.5

338.1

20.6

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 22-Dec-2015

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

UCC38C40DGKR

VSSOP

DGK

8

2500

367.0

367.0

35.0

UCC38C40DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC38C41DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC38C42DGKR

VSSOP

DGK

8

2500

367.0

367.0

35.0

UCC38C42DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC38C43DGKR

VSSOP

DGK

8

2500

367.0

367.0

35.0

UCC38C43DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC38C44DGKR

VSSOP

DGK

8

2500

367.0

367.0

35.0

UCC38C44DR

SOIC

D

8

2500

340.5

338.1

20.6

UCC38C45DGKR

VSSOP

DGK

8

2500

367.0

367.0

35.0

UCC38C45DR

SOIC

D

8

2500

340.5

338.1

20.6

Pack Materials-Page 3

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products

Applications

Audio

www.ti.com/audio

Automotive and Transportation

www.ti.com/automotive

Amplifiers

amplifier.ti.com

Communications and Telecom

www.ti.com/communications

Data Converters

dataconverter.ti.com

Computers and Peripherals

www.ti.com/computers

DLP® Products

www.dlp.com

Consumer Electronics

www.ti.com/consumer-apps

DSP

dsp.ti.com

Energy and Lighting

www.ti.com/energy

Clocks and Timers

www.ti.com/clocks

Industrial

www.ti.com/industrial

Interface

interface.ti.com

Medical

www.ti.com/medical

Logic

logic.ti.com

Security

www.ti.com/security

Power Mgmt

power.ti.com

Space, Avionics and Defense

www.ti.com/space-avionics-defense

Microcontrollers

microcontroller.ti.com

Video and Imaging

www.ti.com/video

RFID

www.ti-rfid.com

OMAP Applications Processors

www.ti.com/omap

TI E2E Community

e2e.ti.com

Wireless Connectivity

www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated

Similar Documents

Premium Essay

Case

...CPET 575 Management of Technology Technological Innovation Case I-1 Elio Engineering, Inc Lecture Note & Summary by Professor Paul I-Hai Lin Pages 13-31 of Text Book: Robert A. Burgelman, Clayton M. Christensen, and Steven C. Wheelwright, Strategic Management of Technology and Innovation, 5th edition, McGrawHill, 2009. Case I-1 Elio Engineering Inc. 1 Outline       Origin of Elio Engineering Seat Mechanism Technologies Industry and Regulatory Environment Technological Barriers and Risks Capabilities Requirements for Players in Automotive Seats and Comparative Company Profiles Decision Time Case I-1 Elio Engineering Inc. 2 1 Origin of Elio Engineering Paul Elio  Hari Saknkara   Technical Capabilities • JCI Benchmarking Department • JCI Structural Design and Analysis Department 1996 -1998 • A patent: revolutionary bike design • Failed venture   Technical Capabilities: 1988 – 1997, JCI’s Structural Design & Analysis Department MBA training 1998 Summer Intern at Booz Allen Hamilton, a management consulting firm  Feb. 1998 • A new seat design “No Compromise”  Feb. 1999 Case I-1 Elio Engineering Inc. 3 Origin of Elio Engineering 1998  First venture meeting: Paul & Hari, at Venice, CA  Agenda • ABTS (All-Belts-To-Seat) • Announcement & comments  A cost effective new seat design - a special class of ABTS Utilizing new technology Resulting structure: Low cost, Light weight, Strong • Features ...

Words: 3130 - Pages: 13

Premium Essay

Case

...THE ON OT C OP YO CASE STUDY HANDBOOK RP OS T ON OP YO RP OT C OS T THE ON OT C Write Persuasively About Cases OP CASE STUDY HANDBOOK How to Read, Discuss, and William Ellet Harvard Business School Press Boston, Massachusetts YO RP OS T Copyright 2007 William Ellet All rights reserved Printed in the United States of America 11 10 09 08 07 5 4 3 2 1 No part of this publication may be reproduced, stored in or introduced into a retrieval system, or transmitted, in any form, or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the prior permission of the publisher. Requests for permission should be directed to permissions@hbsp.harvard.edu, or mailed to Permissions, Harvard Business School Publishing, 60 Harvard Way, Boston, Massachusetts 02163. The copyright on each case in this book unless otherwise noted is held by the President and Fellows of Harvard College and they are published herein by express permission. Permission requests to use individual Harvard copyrighted cases should be directed to permissions@hbsp.harvard.edu, or mailed to the Permissions Editor, Harvard Business School Publishing, 60 Harvard Way, Boston, MA 02163. ON OT C Case material of the Harvard Graduate School of Business Administration is made possible by the cooperation of business firms and other organizations which may wish to remain anonymous by having names, quantities, and......

Words: 96750 - Pages: 387

Premium Essay

Case

...Assignment 1, 2013 – Case Studies Tutorial-based group assessments Due: See ‘Due Dates for Case Study Submission’ section Marks: 30% of the total marks for the unit Background – Learning with Cases Harvard University, probably the most famous source of teaching cases, describes these resources as follows: “Teaching cases – also known as case studies – are narratives designed to serve as the basis for classroom discussion. Cases don’t offer their own analysis. Instead, they are meant to test the ability of students to apply the theory they’ve learned to a ‘real world’ situation … where good accounts of specific events can help exemplify and illuminate theory” (Harvard, 2000). The use of cases based on or around real organisations and/or current issues provides an entirely different approach to learning from that of lectures or more conventional tutorial exercises, where students solve specific problems in isolation from the world of business. Case preparation is a significant part of both undergraduate and postgraduate business study – particularly in the English-speaking world – and it is important to learn to do it effectively and efficiently. I have provided two introductory readings to help you with this process: “Learning Information Systems with Cases” (a pdf file available from your KXO223 MyLO resources) and “Notes on Writing a Case Study Report” (included in this document as Appendix A). Please begin by reading these carefully. Cases are usually based......

Words: 15979 - Pages: 64

Free Essay

Case

...case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case case......

Words: 3640 - Pages: 15

Premium Essay

Case

...Join now! Login Support Other Term Papers and Free Essays Browse Papers Business / Timbuk2 Case Study Timbuk2 Case Study Term Papers Timbuk2 Case Study and over other 20 000+ free term papers, essays and research papers examples are available on the website! Autor: santhanam.vikram 09 December 2013 Tags: Words: 723 | Pages: 3 Views: 86 Read Full Essay Join Now! CASE STUDY: TIMBUK2 1.) Consider the two categories of products that Timbuk2 makes and sells. For the custom messenger bag, what are the key competitive dimensions that are driving sales? Are their competitive priorities different for the new laptop bags sourced in China? Some of the competitive advantage which are the key factors of Timbuk2 bags are:-  Quality  Durable  Reliable  Not prone to defects  Custom made bags for each of the customers  The quick delivery of bags  The rave review which the company gets for its bags i.e. it basically carries a good name in the market  For its laptop bags, even though they are manufactured in china, the designing is done in San Francisco. so the exclusivity remains  Cost effective manufacture of laptop bags in china  Being able to adopt to changes in demand and fashion By manufacturing the bags in china the company saved the manufacturing cost but lost their niche of manufacturing and selling in America itself. The general perception of it being a Chinese product led to customers felling......

Words: 564 - Pages: 3

Premium Essay

Case

.../InstructorResourceManual.pdf‎ The case was prepared by Mark S. Beasley, Ph.D. and Frank A. Buckless, Ph.D. of North Carolina State University and .... Case 1.1: Ocean Manufacturing, Inc. Ocean Manufacutring Inc The New Client Acceptance ... www.studymode.com/.../ocean-manufacutring-inc-the-new-client-accept...‎ Ocean Manufacturing, Inc.: the New Client Acceptance Decision: Case 1.1 Ocean ... Problem Solution: Harrison-Keyes Inc. Ayodeji Ajayi University of Phoenix ... Ocean Manufacturing, Inc.: The New Client Acceptance ... www.freecasestudysolutions.com/case-study-Ocean-Manufacturing-Inc-...‎ Case 1.1 Ocean Manufacturing, Inc.: The New Client Acceptance Decision Ocean Manufacturing, Inc. is recommended as a ... ORDER NEW SOLUTIONS ... Solution Manual for Auditing Cases An Interactive Learning ... testbanksfor.com › All test banks and solution manuals‎ Download Solution Manual for Auditing Cases An Interactive Learning Approach 5th Edition by Beasely. Solution Of Ocean Manufacturing Inc Free Essays 1 - 30 www.papercamp.com/group/solution-of-ocean-manufacturing.../page-0‎ Free Essays on Solution Of Ocean Manufacturing Inc for students. ... ACCT 805AE Case 4 Ocean Manufacturing, Inc The Osprey Group Feb 21, ... Auditing: r c aSe S t h at diSc uSS topicS rel ated to thiS Section 1.1 Ocean Manufacturing, Inc. . Case 1 1 Ocean Manufacturing Inc Free Essays 1 - 30 www.papercamp.com/group/case-1-1-ocean-manufacturing-inc/page-0‎ Case 1.1 Ocean Manufacturing, Inc.:......

Words: 447 - Pages: 2

Premium Essay

Case to Case

...CASE STUDY 2 I. THE ARALIN TEACHER Mrs. Boots De Vola was assigned to teach the first section in third year level. She assumed that she is an effective and efficient teacher in Araling Panlipunan because of that. There are many teachers qualified and much deserving to teach the star section. Now, the students are complaining of the expenses regarding projects, special projects and the way she behave in classroom. II. HISTORY AND BACKGROUND OF THE FACTS Mrs. Boots De Vola have underwent the process of being LSB teacher, PSB teacher, before she was declared as regular teacher in Banana National High School. It has been five years that she handled Aralin in section one. There are congruency on each year complaint but since the students are afraid of failing her subject they remained quiet. I seldom hear news about her projects and the money she collected from her advisory class. Every single mistake has an specified amount to be collected as fine, but the students don’t know where these money will be spent. Another concern about Mrs. Boots De Vola is the way she handled and treated her students. She always nag and shout to students, for her it’s the way of disciplining her students. Some of the students chose to dropped schooling because they felt being degraded and they do not have money for everyday fine. Lately, a mother asked her about the special project of her son amounting one hundred thirty pesos. The project was properly discussed, but we found out that......

Words: 699 - Pages: 3

Premium Essay

Case

...ACE INSTITUTE OF MANAGEMENT Affiliated to POKHARA UNIVERSITY CASE STUDY ON "Managing Motivation in a Difficult Economy" Prepared by Submitted to Raju Karki Shanker Raj Pandey Rama Satyal Ramesh KC Sandeep Amir Kansakar Sanjeev Shrestha THEORETICAL BACKGROUND Motivation is the process that accounts for an individual intensity, direction and persistence of efforts towards attaining a goal. It is the result of interaction between an individual and the situation. Motivated person says "Nothing is impossible” and put his best effort on the task assigned. The different organizational topics covered on the case are as follows:- a. Organizational Justice:- Organizational Justice is the overall perception of what is fair in the workplace. Disruptive Justice is the employee's perception of fairness of the amount and allocation of rewards among individuals. e.g. How much we get paid relative to what we think we should be paid? Similarly, Procedural Justice is the perceived fairness of the process used to determine the distribution of reward. For employees to see a process as a fair, they need to feel they have some control over the outcome and that they were given an adequate explanation about why the outcome occurred. Finally, Interactional Justice is an individual's perception of the degree to which she is treated with dignity, concern and respect. b. Diversity and Age:- Workforce diversity can be studied under two headings:- i.......

Words: 1602 - Pages: 7

Premium Essay

Case

...Case study notes This case has been updated to include the Apple iPad. Principally this is case explores the issue of licensing and how successful firms can become unsuccessful. It is not a case about Apple and why it has become successful. This case study explores the rise of the Apple Corporation. The Apple iPod is one of the most successful new product launches in recent years, transforming the way the public listens to music, with huge ramifications for major record labels. More than 50 million MP3 players are expected to be sold in 2005; over a third more than last year. Mobile phones have long been regarded as the most credible challengers to MP3 players and iPods. The launch of digital download services via mobile phones illustrates the dramatic speed of convergence between the telecom and media industries, which many observers expect to usher in a new era of growth for mobile phones. Users are willing to pay more for additional services and many analysts predict that mobile phone handsets will eventually emerge as the dominant technology of the age, combining personal organisers, digital music players and games consoles in a single device. Indeed, Microsoft founder Bill Gates has predicted that mobile phones will supersede the iPod as the favoured way of listening to digital music. The launch of the Apple ipad in 2010 makes this case even more topical. This should form the basis of supplementary questions at the end of the case: How will the iPhone succeed? What......

Words: 16512 - Pages: 67

Premium Essay

Cases

...Income-tax has stated a case for our opinion on the four questions of law submitted in para 15. Question (4) deals with the genuineness of the alleged loans, but in para 33 the Commissioner explains the basis on which he has submitted this question, although in one sense it may be said to be a question of fact. Turning to the facts it appears that in the year 1921 the assessee formed four private companies which I will call family companies for convenience of reference, although in fact no other member of his family took any direct benefit thereunder. The names of these four companies were Petit Limited: The Bombay Investment Company Limited: The Miscellaneous Investment Company: and the Safe Securities Limited: Each of these companies took over a particular block of investments belonging to the assessee. But as the modus operandi was substantially the same in each case it will suffice to follow out the fortunes of Petit Limited. Taking then Petit Limited as an example, this family company was incorporated about April 12, 1921, with a nominal capital of rupees ten millions divided ultimately into 9,99,900 ordinary shares of Rs. 10 each and one hundred preference shares of Rs. 10 each carrying a fixed cumulative preferential dividend of six per cent. Its issued and subscribed capital consists of 3,48,604 fully paid ordinary shares all held by the assessee, and three fully paid preference shares held by three persons who are alleged in para 24 of the case to be his......

Words: 8140 - Pages: 33

Premium Essay

Case

...Rules on Criminal Procedure, to wit: “Sec. 5. Arrest without warrant; when lawful. — A peace officer or a private person may, without a warrant, arrest a person: (a) When, in his presence, the person to be arrested has committed, is actually committing, or is attempting to commit an offense; (b) When an offense has in fact just been committed, and he has personal knowledge of facts indicating that the person to be arrested has committed it; and (c)When the person to be arrested is a prisoner who escaped from a penal establishment or place where he is serving final judgment or temporarily confined while his case is pending, or has escaped while being transferred from one confinement to another. Under Section 5 (a), as above-quoted, a person may be arrested without a warrant if he “has committed, is actually committing, or is attempting to commit an offense.” In the case at bar, Appellant Doria was caught in the act of committing an offense. When an accused is apprehended in flagrante delicto as a result of a buy-bust operation, the police are not only authorized but duty-bound to arrest him even without a warrant. There is no rule of law which requires that in "buy-bust" operations there must be a simultaneous exchange of the marked money and the prohibited drug between the poseur-buyer and the pusher. Again, the decisive fact is that the poseur-buyer received the marijuana from the accused-appellant. 2. The warrantless arrest of appellant Gaddao, the search of......

Words: 9859 - Pages: 40

Free Essay

Case

...add-on. Initial paper work took some time, so the new patients were asked to come earlier so that the work could be completed on time. Also informing the new patients to adhere to appointment timings was a usual practice to avoid delays. What procedures were followed to keep the appointment system flexible enough to accommodate the emergency cases, and yet be able to keep up with the other patients’ appointments? It is often observed that doctors misuse the time and often emergency cases are taken as excuses for not adhering to the schedule. It was important to make the system flexible to adjust the emergency cases as well as to adhere to the timelines and get back to schedule. In case of real emergencies like fractures or caesarean section etc., all other appointments could be dropped; however in case of small issues, the doctor was expected to come back on track as early as possible and give the patient a choice to wait or reschedule the appointment. Also the assistant of the doctors were ordered to keep some open slots throughout the day for the patients suffering acutely. This time was also used to look into the emergency cases....

Words: 318 - Pages: 2

Free Essay

Case

...Siyu Zhang Case 2 Feb.22 Paperback writer The professor’s book title, Criminal Intent, does not have any kind of legal protection. In order for literary or artistic expression to be protected from copying it must meet three requirements by law. The requirements for obtaining legal protection on this kind of material include the following: it must be original, it must be fixed in a durable medium, and it must show some level of creativity. In this case, Criminal Intent was obviously published in a durable medium; however its level of originality and creativity are minor at best. On the other hand, the titles of the Rolling Stones songs are entitled to legal protection. First of all, titles such as Honky Tonk Woman and 19th Nervous Breakdown would probably be considered more creative and original than in the case with Criminal Intent. Therefore, the Rolling Stones song titles meet all three requirements for protection of artistic expression. Also, this protection would be largely due to the popularity the songs achieved when they were released. The Federal Trademark Dilution Act of 1995 aims to protect trademarks from unauthorized uses even when it is unlikely to confuse consumers. Under Trademark law, an expression may be given protection if it acquires a secondary meaning, meaning that the term or expression has become closely associated with a particular company (in this case, these specific song titles being associated with Rolling Stones). For these......

Words: 660 - Pages: 3

Premium Essay

Case

...Assignment Questions for Harvard Cases 3. Hilton Manufacturing Company In Exhibit 3 of the case, change the description for estimating variable portion of "Compensation" and use 5% of direct labor cost rather than 5% of direct labor and indirect labor cost as indicated in that Exhibit 3. Again, DO NOT USE 5% of DL and IDL costs. A product cost is itself a product of a cost accounting system. To use product cost information in decision making, a manager must understand the nature of the cost measurement system that has been used to estimate a product cost and be able to evaluate whether or not the product cost at hand is appropriate for the decision which is about to be made. A second objective is to provide practice in considering whether or not assumptions about cost behavior are critical to decisions and to expand the notion of contribution beyond the simple idea of price minus variable cost per unit. A third objective introduces the concept of breakeven analysis, not by focusing on the point where no profit is earned but rather as a tool to consider whether or not one of two price points might be preferred. Finally, the last assignment question invites you to consider factors that lead to profitability. You begin your analysis by focusing on two issues raised in the assigned questions. The first is whether the decision not to drop Product 103 as of January 1, 2004 was wise. In addition, you are asked to analyze what would have been the impact on......

Words: 1312 - Pages: 6

Free Essay

Case

...A few tips from Bain & Company: • • • • • Don't get thrown by the interviewer's questions. The interviewer is your ally and uses questions to get a better understanding of your thought process--not to stump you. Be concise. If asked for the top two issues, confine your response to two items. Provide logical back-up for your answers. Be sure to explain what case facts led you to a conclusion, and how you reasoned from those facts to your conclusion. Don't be afraid to ask clarifying questions. If you don't understand the case facts, it will be tough to ace the interview. Relax and have fun. You should learn a lot about yourself through the case interview process. A few tips from Mercer Management: • • • • There is no "right" answer. We are not looking for a specific answer. We are trying to gain some insight on your thought process. Ask questions. We do not expect you to know anything about the industry presented in your case. We do expect you to ask good questions. Think out loud. The point of the case interview is to understand how you think. Structure your answer. We're looking for an organized pattern of thought to attack the problem, not a disparate set of ideas. Help us see how you order your thoughts and ideas, moving from one to the next in order to address the question. While use of a framework may be helpful in this area, be careful if you use one. We want to understand your thought process, not see that you've memorized someone else's framework. (And never use a......

Words: 382 - Pages: 2